The Effect OfOxidation of Cu-Base Leadframe onInterface Adhesion Between Cu Metal and Epoxy Molding Compound

By: Material type: ArticleArticleDescription: 167-175 pSubject(s): In: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
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Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.20, No.02 (May. 1997) Available