The Effect OfOxidation of Cu-Base Leadframe onInterface Adhesion Between Cu Metal and Epoxy Molding Compound (Record no. 744355)

MARC details
000 -LEADER
fixed length control field 00634nab a2200169Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s1997 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Cho, Soon-Jin
9 (RLIN) 778462
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Paik, Kyung-Wook
9 (RLIN) 768099
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Kim, Yong-Ju
9 (RLIN) 778463
245 #4 - TITLE STATEMENT
Title The Effect OfOxidation of Cu-Base Leadframe onInterface Adhesion Between Cu Metal and Epoxy Molding Compound
300 ## - PHYSICAL DESCRIPTION
Extent 167-175 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Adhesion
9 (RLIN) 51632
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Copper Oxide
9 (RLIN) 692635
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Leadframes
9 (RLIN) 770024
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 1997
Title IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
International Standard Serial Number 10709894
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.20, No.02 (May. 1997)   19/08/2023 Articles