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The Effect OfOxidation of Cu-Base Leadframe onInterface Adhesion Between Cu Metal and Epoxy Molding Compound

Cho, Soon-Jin Paik, Kyung-Wook Kim, Yong-Ju

The Effect OfOxidation of Cu-Base Leadframe onInterface Adhesion Between Cu Metal and Epoxy Molding Compound - 167-175 p.

Subjects--Topical Terms:
Adhesion
Copper Oxide
Leadframes

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