Low Temperature Plasma Deposition of Silicon Nitride to Produce Ultra-Reliable High Performance Low Cost Sealed Chip-on-Boand (Scob) Assemblies

By: Material type: ArticleArticleDescription: 471-477 pSubject(s): In: IEEE Transactions on Components Packaging and Manufacturing Technology Part A
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Articles Articles Periodical Section Vol.18, No.03 (Sep. 1995) Available