Low Temperature Plasma Deposition of Silicon Nitride to Produce Ultra-Reliable High Performance Low Cost Sealed Chip-on-Boand (Scob) Assemblies (Record no. 743136)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 00554nab a2200133Ia 4500 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 230808s1995 |||||||f |||| 00| 0 eng d |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Kubacki, Ronald M. |
| 9 (RLIN) | 775442 |
| 245 #0 - TITLE STATEMENT | |
| Title | Low Temperature Plasma Deposition of Silicon Nitride to Produce Ultra-Reliable High Performance Low Cost Sealed Chip-on-Boand (Scob) Assemblies |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 471-477 p. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Temperature Plasma |
| 9 (RLIN) | 775443 |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | High Performance |
| 9 (RLIN) | 170051 |
| 773 ## - HOST ITEM ENTRY | |
| Place, publisher, and date of publication | 1995 |
| Title | IEEE Transactions on Components Packaging and Manufacturing Technology Part A |
| International Standard Serial Number | 10709886 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | Articles |
| -- | 51 |
| -- | ABUL KALAM Library |
| Not for loan | Home library | Serial Enumeration / chronology | Total Checkouts | Date last seen | Koha item type |
|---|---|---|---|---|---|
| Engr Abul Kalam Library | Vol.18, No.03 (Sep. 1995) | 19/08/2023 | Articles |