Low Temperature Plasma Deposition of Silicon Nitride to Produce Ultra-Reliable High Performance Low Cost Sealed Chip-on-Boand (Scob) Assemblies
Kubacki, Ronald M.
Low Temperature Plasma Deposition of Silicon Nitride to Produce Ultra-Reliable High Performance Low Cost Sealed Chip-on-Boand (Scob) Assemblies - 471-477 p.
Temperature Plasma
High Performance
Low Temperature Plasma Deposition of Silicon Nitride to Produce Ultra-Reliable High Performance Low Cost Sealed Chip-on-Boand (Scob) Assemblies - 471-477 p.
Temperature Plasma
High Performance