Electroless Nickel Bumping of Aluminum Bondpads Part I Surface Pretreatment and Activation

By: Material type: ArticleArticleDescription: 87-97 pSubject(s): In: IEEE Transactions on Components and Packaging Technologies
Holdings
Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.25, No.01 (Mar. 2002) Available