Electroless Nickel Bumping of Aluminum Bondpads Part I Surface Pretreatment and Activation
Hutt, David A. liu, Changqing Mannan, Samjid H.
Electroless Nickel Bumping of Aluminum Bondpads Part I Surface Pretreatment and Activation - 87-97 p.
Electroless Nickel Plating
Flip-Chip
Bump Characterization
Electroless Nickel Bumping of Aluminum Bondpads Part I Surface Pretreatment and Activation - 87-97 p.
Electroless Nickel Plating
Flip-Chip
Bump Characterization