Electroless Nickel Bumping of Aluminum Bondpads Part I Surface Pretreatment and Activation (Record no. 741301)

MARC details
000 -LEADER
fixed length control field 00604nab a2200169Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2002 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Hutt, David A.
9 (RLIN) 770977
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name liu, Changqing
9 (RLIN) 770979
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Mannan, Samjid H.
9 (RLIN) 770980
245 #0 - TITLE STATEMENT
Title Electroless Nickel Bumping of Aluminum Bondpads Part I Surface Pretreatment and Activation
300 ## - PHYSICAL DESCRIPTION
Extent 87-97 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Electroless Nickel Plating
9 (RLIN) 768424
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Flip-Chip
9 (RLIN) 765290
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Bump Characterization
9 (RLIN) 768387
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2002
Title IEEE Transactions on Components and Packaging Technologies
International Standard Serial Number 15213331
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.25, No.01 (Mar. 2002)   19/08/2023 Articles