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Silicon Wafer Bonding Technology for VLSI and Mems Applications

By: Contributor(s): Material type: TextTextLanguage: English Series: Emis Processing Series ; No. 1Publication details: London : Inspec, c2002Description: XXV, 149 p. : illISBN:
  • 0852960395
Subject(s): DDC classification:
  • 621.38152 IYE
Online resources:
Holdings
Item type Current library Shelving location Call number Status Date due Barcode
Lending Collection Lending Collection Circulation Section Circulation Section 621.38152 IYE Available 67826