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Low Temperature Plasma Deposition of Silicon Nitride to Produce Ultra-Reliable High Performance Low Cost Sealed Chip-on-Boand (Scob) Assemblies by
  • Kubacki, Ronald M
Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Study of Physico-Chemical Surface Treatments on Dyeing Pproperties of Polyamides . Part 1. Effect of Tetrafluoromethane Low Temperature Plasma by
  • Yip, Joanne
  • Chan, Kwong
  • Sin, Kwan Moon
Source: Coloration Technology
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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