Your search returned 3 results.

Results
		Electroless Ni Cu P Barrier Between Si/Ti/Al Pad and Sn-Pb Flip-Chip Solder Bumps by Chen, Chun-Jen lin, Kwang-Lung Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Electroless Nickel Bumping of Aluminum Bondpads Part I Surface Pretreatment and Activation by Hutt, David A liu, Changqing Mannan, Samjid H Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Electroess Nickel Bumping of Aluminum Bondpads Part II Electroless Nickel Olating by Hutt, David A liu, Changqing Whaliey, David B Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

Refine your search