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		Dynamic Thermal Multiport Modeling of Ic Packages by Rencz, Marta Szekely, Vladimir Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Mapping of Mechanical, Thermomechanical and Wire-Bond Strain Fields in Packaged Si Integrated Circuits Using Synchrotron White Beam X-Ray Topography by Mcnaliy, Patrick J Danilewsky, A. N Curledy, John W Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Cracking Failures in Lead-on Chip Packages Induced by Chip Backside Contamination by Amagai, Masazumi Ebe, Kazuyoshi Seno, Hideo Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effect of Pcb Finish onReliability and Wettability of Bali Grid Array Packages by Bradley, Edwin Banerji, Kingshuk Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Package Analysis Tool Based on a Method of Moments Surface Formulation by Ponnapalil, Saila Bertin, Robert Deutsch, Alina Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Model and Analyses for Solder Reflow Cracking Phenomenon in Smt Plastic Packages by Ganesan, Gams S Berg, Howard M Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Characterization and Modeling of Packages by a Time-Domain Reflectometry Approach by De Zutter, Daniel Botte, Marnix Herreman, Mieke Van Hauwermeiren, Luc Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Parasitic Modeling and Analysis for A 1 Gbs Cmos Laser Driver by Jung, Sungyong Brooke, Martin A Jokerst, Nan Marie Source: Ieee Transactions on Circuits and Systems-Ii: Express Briefs ( for merly: Analog & Digital Signal Processing) Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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