Model and Analyses for Solder Reflow Cracking Phenomenon in Smt Plastic Packages

By: Material type: ArticleArticleDescription: 940-948 pSubject(s): In: IEEE Transactions on Components Hybrids and Manufacturing Technology
Holdings
Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.16, No.08 (Dec. 1993) Available