Normal view MARC view ISBD view

Model and Analyses for Solder Reflow Cracking Phenomenon in Smt Plastic Packages

Ganesan, Gams S. Berg, Howard M.

Model and Analyses for Solder Reflow Cracking Phenomenon in Smt Plastic Packages - 940-948 p.

Subjects--Topical Terms:
Model and Analysis
Smt
Package Modeling

Print
Request article
Suggest for purchase
Send to device
Save record
BIBTEX Dublin Core ISBD MARCXML RIS
More searches

Search for this title in:
Other Databases (Google Scholar) Open Library (openlibrary.org) Pakistan Union Catalogue (pastic.gov.pk) Other Libraries (WorldCat)