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		Enhanced Dielectric and Piezoelectric Properties in litao3-Doped Lead-Free (K,Na)Nbo3 Ceramics by Optimizing Sintering Temperature by Zhao, Pei Source: Scripta Materialia Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Re-Calibration of Engelmaier'S Model for Leadless, Lead-Free Solder Attachments by Salmela, Olil Source: Quality and Reliability Engineering International Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Effect of (li,Ce) Doping in Aurivililus Phase Material Na0.25k0.25bi4.5ti4o15 by Gai, Zhi-Gang Source: Scripta Materialia Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Effect of Power Cycling onReliability of Lead-Free Surface Mount Assembies by Davitt, Elaine Stam, Frank A Barrett, John Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Development of No-Flow Underfili Materials for Lead-Free Solder Bumped Flip-Chip Applications by Zhang, Z Shi, S. H Wong, C. P Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Fluxless Process of Producing Tin-Rich Gold -Tin Joints in Air by Chuang, Ricky W Kim, DonGWOok Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Development of Lead Free Wave Soldering Process by Arra, Minna Source: Ieee Transactions onElectronics Packaging Manufacturing Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Pure Matte Tin, Tin-Silver, Tin-Bismuth, and Tin-Copper Electrodeposits for Lead-Free Coatings Are Evaluated by Jordan, M Source: Metal Finishing Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Assembly of Lead-Free Bumped Flip-Chip with No-Flow Underfills by Zhang, Zhuquing Source: Ieee Transactions onElectronics Packaging Manufacturing Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Modeling and Analysis of 96.5sn-3.5ag Lead-Free Solder Joints of Wafer Level Chio Scale Package on Buildup Microvia Printed Circuits Board by Lau, J Lee, Ricky Source: Ieee Transactions onElectronics Packaging Manufacturing Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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