Modeling and Analysis of 96.5sn-3.5ag Lead-Free Solder Joints of Wafer Level Chio Scale Package on Buildup Microvia Printed Circuits Board

By: Material type: ArticleArticleDescription: 51-58 pSubject(s): In: Ieee Transactions onElectronics Packaging Manufacturing
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Articles Articles Periodical Section Vol.25, No.01 (Jan. 2002) Available