Normal view MARC view ISBD view

Modeling and Analysis of 96.5sn-3.5ag Lead-Free Solder Joints of Wafer Level Chio Scale Package on Buildup Microvia Printed Circuits Board

Lau, J Lee, Ricky

Modeling and Analysis of 96.5sn-3.5ag Lead-Free Solder Joints of Wafer Level Chio Scale Package on Buildup Microvia Printed Circuits Board - 51-58 p.

Subjects--Topical Terms:
Lead-Free Solder
Microvia
Pcb

Print
Request article
Suggest for purchase
Send to device
Save record
BIBTEX Dublin Core ISBD MARCXML RIS
More searches

Search for this title in:
Other Databases (Google Scholar) Open Library (openlibrary.org) Pakistan Union Catalogue (pastic.gov.pk) Other Libraries (WorldCat)