Your search returned 12 results.

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		Solder Paste in Electronics Packaging Technology and Applications in Surface Mount Hybrid Circuits and Component Assembly by Hwang, Jennie S [author] Material type: Text Language: English Publication details: New York : Van Nostrand Reinhold, c1992 Online access: Table of Contents Availability: Items available for loan: Circulation Section (1)Location, call number: Circulation Section 621.381531 HWA.
		Applied Surface Mount Assembly a Guide to Surface Mount Materials and Processes by Rowland, Robert [author] Belangia, Paul [author] Material type: Text Language: English Publication details: New York : Van Nostrand Reinhold, c1993 Online access: Table of Contents Availability: Items available for loan: Circulation Section (1)Location, call number: Circulation Section 621.381531 ROW.
		Surface Mount Technology Principles and Practice by Prasad, Ray P [author] Edition: 2nd Material type: Text Language: English Publication details: New York : Chapman and Hall, c1997 Online access: Table of Contents Availability: Items available for loan: Circulation Section (1)Location, call number: Circulation Section 621.381531 PRA.
		Surface Mount Technology for Concurrent Engineering and Manufacturing by Classon, Frank [author] Series: Electronic Packaging and Interconnection Series Material type: Text Language: English Publication details: New York : McGraw-Hill, c1993 Online access: Table of Contents Availability: Items available for loan: Circulation Section (1)Location, call number: Circulation Section 621.381531 CLA.
		Fatigue life Estimation of Surface Mount Solder Joints by Xie, D Hui, I. K Lai, J. K. L Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Aging Studies of Cu-Sn Intermetalilc Compounds in Annealed Surface Mount Solder Joints by So, Alex C. K Lai, J. K. L Chan, Yan C Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Rheological Characterization of Solder Pastes for Surface Mount Applications by Kolil, Venkata Giri anderson, Ruth Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Grain Boundary Sliding in Surface Mount Solders During Thermal Cycling by Stone, Donald S Lee, Seong-Min Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Inverted T-Joint for Surface Mount Connectors by Watanabe, Toshinori Yamada, Shoji E Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Use Environments of Electronic Assemblies and Their Impact on Surface Mount Solder Attachment Reliability by Engelmaier, Werner Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Measurement and Modeling of in Situ Lead Stiffness of Surface Mounted Packages by Jain, Praveen Jahsman, W.E Pope, Elaine Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Improvements in Wire Bonding and Solderability of Surface Mount Components Using Plasma Cleaning Techniques by Rust, Ray D Doane, Daryl Ann Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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