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Solder Paste in Electronics Packaging Technology and Applications in Surface Mount Hybrid Circuits and Component Assembly

By: Material type: TextTextLanguage: English Publication details: New York : Van Nostrand Reinhold, c1992Description: XXII, 456 p. : illISBN:
  • 0442207549
Subject(s): DDC classification:
  • 621.381531 HWA
Online resources:
Holdings
Item type Current library Shelving location Call number Status Date due Barcode
Lending Collection Lending Collection Circulation Section Circulation Section 621.381531 HWA Available 87393