Solder Paste in Electronics Packaging Technology and Applications in Surface Mount Hybrid Circuits and Component Assembly
Material type: TextLanguage: English Publication details: New York : Van Nostrand Reinhold, c1992Description: XXII, 456 p. : illISBN:- 0442207549
- 621.381531 HWA
Item type | Current library | Shelving location | Call number | Status | Date due | Barcode |
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Lending Collection | Circulation Section | Circulation Section | 621.381531 HWA | Available | 87393 |