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Solder Paste in Electronics Packaging Technology and Applications in Surface Mount Hybrid Circuits and Component Assembly

Hwang, Jennie S.

Solder Paste in Electronics Packaging Technology and Applications in Surface Mount Hybrid Circuits and Component Assembly - New York : Van Nostrand Reinhold, c1992 - XXII, 456 p. : ill

Includes Bibliographical References and Index

ISBN: 0442207549

ISSN:

Subjects--Topical Terms:
Printed Circuits Design and Construction
Solder Pastes
Surface Mount Technology

Dewey Class. No.: 621.381531 / HWA

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