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		Recent Advances in Plastic Packaging of Flip Chip and Multichip Modules Mcm of Microelectronics by Wong, C. P Wong, Michelie M Source: IEEE Transactions on Components and Packaging Technologies Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Numerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading Part lil Material Properties and Package Geometries by Saitoh, Takehisa Toya, M Matsuyama, Y Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Study onPressurized Underfili Encapsulation of Flip Chips by Han, Sejin Wang, K. K Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Improved Thermal Conductivity in Microelectronic Encapsulants by Procter, Philip Solc, Jitka Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Encapsulants Used in Flip-Chip Packages by Suryanarayana, Darbha Wu, Tien H Varcoe, Jack A Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Encapsulant for Fatigue life Enhancement of Controlied-Coliapse Chip Connection C4 by Wang, David W Papathomas, Kostas I Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Encapsulant for Nonhermetic Multichip Packaging Applications by lin, A.W Wong, Ching-Ping Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Adhesive Evaluation on Low-Cost Alternatives to Thermosetting Epoxy Encapsulants by Fan, Lianhua Source: Ieee Transactions onElectronics Packaging Manufacturing Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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