Recent Advances in Plastic Packaging of Flip Chip and Multichip Modules Mcm of Microelectronics

By: Material type: ArticleArticleDescription: 21-26 pSubject(s): In: IEEE Transactions on Components and Packaging Technologies
Holdings
Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.22, No.01 (Mar. 1999) Available