Recent Advances in Plastic Packaging of Flip Chip and Multichip Modules Mcm of Microelectronics (Record no. 740906)

MARC details
000 -LEADER
fixed length control field 00541nab a2200157Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s1999 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Wong, C. P.
9 (RLIN) 93201
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Wong, Michelie M.
9 (RLIN) 769984
245 #0 - TITLE STATEMENT
Title Recent Advances in Plastic Packaging of Flip Chip and Multichip Modules Mcm of Microelectronics
300 ## - PHYSICAL DESCRIPTION
Extent 21-26 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Encapsulant
9 (RLIN) 769985
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Epoxidation
9 (RLIN) 728683
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Flip-Chip
9 (RLIN) 765290
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 1999
Title IEEE Transactions on Components and Packaging Technologies
International Standard Serial Number 15213331
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.22, No.01 (Mar. 1999)   19/08/2023 Articles