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		Spatial and Temporal Control OfDegree of Cure in Polymer Composite Structures by Spicer, J.W.M Hurley, D.H Shuli, P.J Source: Polymer Engineering and Science Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Time-Temperature-Trans Formation (Ttt) Cure Diagrams: Relationships Between Tg, Cure Temperature, and Time for Dgeba/Deta Systems by Guibe, C Franciliette, J Source: Journal of Applied Polymer Science Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Cure Synergism in Xnbr Vulcanization in Presence of Thiophosphoryl Disulfides and Amine Disulfide/Thiazole Accelerators by Biswas, Tapasi Kumar Basu, Dipak Source: Journal of Applied Polymer Science Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Cure Kinetics of Neat and Carbon- Fiber Reinforced Tgddm/Dds Epoxy Systems by Opalicki, M Nicolais, L Source: Journal of Applied Polymer Science Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Kinetic Study and Time-Temperature-Trans Formation Cure Diagram for an Epoxy-Diamine System by Nunez, liSARdo Fraga, F Nunez, A Source: Journal of Applied Polymer Science Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effect of Cure Conditions on Probimide 32 Polyamide-Imide by Cebe, Peggy Sichel, Enid K Rich, David C Source: Journal of Applied Polymer Science Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Evolution of Properties of an Isocyanate/Epoxy Thermosetting System During Cure: Continuous Heating (Cht) and Isothermal Time-Temperature-Trans Formation (Ttt) Cure Diagrams by Demeuse, M. T Giliham, J. K Parodi, F Source: Journal of Applied Polymer Science Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Silicone Die Bond Adhesive and Clean In-line Cure for Copper Lead Frame by Suzuki, Kazunari Higashino, Tomoko Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		An Integrated Process Modeling Methodology and Module for Sequential Multilayered Substrate Fabrication Using A Coupled Cure-Thermal-Stress Analysis Approach by Dunne, E Source: Ieee Transactions onElectronics Packaging Manufacturing Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		A Cure for Bioengineering? A New Undergraduate Core Curriculum by Desai, Tejal A Magin, Richard L Source: Journal of Engineering Education Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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