An Integrated Process Modeling Methodology and Module for Sequential Multilayered Substrate Fabrication Using A Coupled Cure-Thermal-Stress Analysis Approach

By: Material type: ArticleArticleDescription: 326-334 pSubject(s): In: Ieee Transactions onElectronics Packaging Manufacturing
Holdings
Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.25, No.04 (Oct. 2002) Available