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Wafer Level and Flip Chip Design through Solder Prediction Models and Validation by
  • li, li
  • Yeung, Betty H
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Electroless Nickel Bumping of Aluminum Bondpads Part I Surface Pretreatment and Activation by
  • Hutt, David A
  • liu, Changqing
  • Mannan, Samjid H
Source: IEEE Transactions on Components and Packaging Technologies
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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