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Response Surfaces, Blocking and Split Plots: an Industrial Experiment Case Study by
  • Jensen, Wilils A
  • Kowalski, Scott M
Source: Quality Engineering
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Thermomechanical Models for Leadless Solder Interconnections in Flip Chip Assemblies by
  • King, Wilton W
  • Stephenson, Daniel L
Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Modular Adapters for Fiber Optics by
  • King, Wilton W
  • Stephenson, Daniel L
Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Block Iterative Methods for Elliptic Finite Element Equations by
  • Steuerwalt, Michael
  • Parter, Seymour V
Source: Siam Journal on Numerical Analysis
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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