Thermomechanical Models for Leadless Solder Interconnections in Flip Chip Assemblies

By: Material type: ArticleArticleDescription: 177-185 pSubject(s): In: IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Holdings
Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.21, No.01 (Mar. 1998) Available