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		Mechanical Mililng of Mg, Ni and Y Powder Mixture and InvestigatingEffects of Produced Nanostructured Mgni4y on Hydrogen Desorption Properties of Mgh2 by Chitsazkhoyi, L Raygan, Sh Source: International Journal of Hydrogen Energy Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effect of Nickel on Microstructure and Wear Behaviour of Pure Aluminium Against Steel and Alumina Counterfaces by Yamanoglu, R Karakulak, E Zeren, M Koc, F. G Source: International Journal of Cast Metals Research Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effect of Laser Input Energy on Ausnx Intermetalilc Compounds Formation in Solder Joints with Different Thickness of Au Surface Finish on Pads by liu, W Source: Acta Metaliurgica Sinica Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Aging Studies of Cu-Sn Intermetalilc Compounds in Annealed Surface Mount Solder Joints by So, Alex C. K Lai, J. K. L Chan, Yan C Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Interface Reaction Between Ag-Pd Conductor and Pd-Sn Solder by Moriya, Yoichi Shinya, Ryuji Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Aging Effects on Shear Fatigue life and Shear Strength of Soldered Thick Film Joints by Chan, Y. C li, G. Y Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effect Intermetalilc Compounds onShear Fatigue of Cu/63sn-37pb Solder Joints by Chan, Y.C Tu, P, L Lai, J Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Intermetalilc Formation onFracture of Sn/Pb Solder and Pd/Ag Conductor Interfaces by Chiou, Bi-Shiou liu, K. C Duh, Jenq-Gong Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Effect of High-Temperature Intermetalilc Growth on Bali Shear-Induced Cratering by Clatterbaugh, Guy V Charles, Jr, Harry K Source: IEEE Transactions on Components Hybrids and Manufacturing Technology Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article

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