Intermetalilc Formation onFracture of Sn/Pb Solder and Pd/Ag Conductor Interfaces

By: Material type: ArticleArticleDescription: 267-274 pSubject(s): In: IEEE Transactions on Components Hybrids and Manufacturing Technology
Holdings
Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.13, No.02 (Jun. 1990) Available