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		Apparatus to InvestigateInsulation Impedance and Accelerated life-Testing of Neural Interfaces by Donaldson, N Idil, a Shah Lamont, C Mentink, M Source: Journal of Neural Engineering Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Bond Strength of Reinforcing Bars with Varying Encapsulation Qualities by Jolin, M Massicotte, Bruno Bissonnette, Benoit Source: ACI Structural Journal Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Optimization OfSpray Drying Operating Conditions for ProducingPowder Mixture of Gum Arabic and Maltodextrin by Nguyen, Duc Quang Mounir, Sabah Aliaf, Karim Source: International Journal of Food Engineering Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Encapsulation of Solid Waste Incinerator Ash in Geopolymer Concretes and its Applications by Kupwade-Patil, Kunal Aliouche, Erez N Gunasekaran, Alfred Source: ACI Materials Journal Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Functional Oligothiophenes Toward Molecular Wires in Single-Molecular Electronics by Le, Yutaka Source: Pure and Applied Chemistry (International Journal of) Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		The Targeted Delivery of Multicomponent Cargos to Cancer Celis by Nanoporous Particle-Supported lipid Bilayers by Ashley, Carlee E Carnes, Eric C Phililps, Genevieve K Padilia, David Source: Nature Materials Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effect of Overspray Treatments onProcessing Efficiency of a 50/50 Flax/Cotton Blend by Gamble, Gary Foulk, Jonn Source: Textile Research Journal Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Enzyme and Chemical Encapsulation in Polymeric Microcapsules by ParthaSARathy, Ranjani V Martin, Charles R Source: Journal of Applied Polymer Science Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Effects of Filiers on Wire Sweep in Semiconductor Chip Encapsulation by Han, Sejin Wang, K. K Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Three-Dimensional Simulation of Microchip Encapsulation Process by Han, Ruihua Shi, linhuo Gupta, Mahesh Source: Polymer Engineering and Science Material type: Article; Format: print Availability: Items available for loan: Engr Abul Kalam Library (1). Request article
		Encapsulated Admixtures with Temporary Coatings for Delayed Delivery of Core Material—Review by Natkunarajah, Kapilraj Masilamani, Koneswaran Amarasinghe, D.A.S Attygalle, Dinesh Source: ACI Materials Journal Material type: Article; Format: print Online access: Click here to access online Availability: Items available for loan: Periodical Section (1). Request article

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