Effects of Filiers on Wire Sweep in Semiconductor Chip Encapsulation

By: Material type: ArticleArticleDescription: 744-750 pSubject(s): In: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Holdings
Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.18, No.04 (Nov. 1995) Available