A Feasibility Study for Fabrication of Planar Silicon Multichip Modules Using Electron Beam lithography for Precise Location and Interconnection of Chips

By: Material type: ArticleArticleDescription: 97-102 pSubject(s): In: IEEE Transactions on Components Hybrids and Manufacturing Technology
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Articles Articles Periodical Section Vol.15, No.01 (Feb. 1992) Available