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The Effect OfOxidation of Cu-Base Leadframe onInterface Adhesion Between Cu Metal and Epoxy Molding Compound by
  • Cho, Soon-Jin
  • Paik, Kyung-Wook
  • Kim, Yong-Ju
Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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Interconnection Parameter Extraction of Printed Circuit Board By Hybrid Measurements of Tdr and S-Parameter by
  • Kim, Yong-Ju
  • Kim, Young-Hee
  • Wee, Jae-Kyung
Source: IET:IEE: Electronics Letters
Material type: Article Article; Format: print
Availability: Items available for loan: Engr Abul Kalam Library (1).
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