A Wafer Level Testability Approach Based on an Improved Scan Insertion Technique

By: Material type: ArticleArticleDescription: 438-447 pSubject(s): In: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
Holdings
Item type Current library Call number Vol info Status Date due Barcode
Articles Articles Periodical Section Vol.18, No.03 (Aug. 1995) Available