Numerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading Part lil Material Properties and Package Geometries (Record no. 744438)

MARC details
000 -LEADER
fixed length control field 00673nab a2200169Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s1998 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Saitoh, Takehisa
9 (RLIN) 726960
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Toya, M
9 (RLIN) 778675
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Matsuyama, Y
9 (RLIN) 677163
245 #0 - TITLE STATEMENT
Title Numerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading Part lil Material Properties and Package Geometries
300 ## - PHYSICAL DESCRIPTION
Extent 407-412 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Die Bond
9 (RLIN) 775169
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Encapsulant
9 (RLIN) 769985
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Temperature
9 (RLIN) 119334
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 1998
Title IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
International Standard Serial Number 10709894
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
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-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.21, No.04 (Nov. 1998)   19/08/2023 Articles