Numerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading Part lil Material Properties and Package Geometries
Saitoh, Takehisa Toya, M Matsuyama, Y
Numerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading Part lil Material Properties and Package Geometries - 407-412 p.
Die Bond
Encapsulant
Temperature
Numerical Stress Analysis of Resin Cracking in Lsi Plastic Packages Under Temperature Cyclic Loading Part lil Material Properties and Package Geometries - 407-412 p.
Die Bond
Encapsulant
Temperature