Aging Studies of Cu-Sn Intermetalilc Compounds in Annealed Surface Mount Solder Joints (Record no. 744353)

MARC details
000 -LEADER
fixed length control field 00619nab a2200169Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s1997 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name So, Alex C. K.
9 (RLIN) 774423
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Lai, J. K. L.
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Chan, Yan C.
9 (RLIN) 774424
245 #0 - TITLE STATEMENT
Title Aging Studies of Cu-Sn Intermetalilc Compounds in Annealed Surface Mount Solder Joints
300 ## - PHYSICAL DESCRIPTION
Extent 161-166 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Intermetalilc
9 (RLIN) 721631
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Reliability
9 (RLIN) 53955
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Surface Mount Technology
9 (RLIN) 96171
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 1997
Title IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
International Standard Serial Number 10709894
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
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-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.20, No.02 (May. 1997)   19/08/2023 Articles