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Aging Studies of Cu-Sn Intermetalilc Compounds in Annealed Surface Mount Solder Joints

So, Alex C. K. Lai, J. K. L. Chan, Yan C.

Aging Studies of Cu-Sn Intermetalilc Compounds in Annealed Surface Mount Solder Joints - 161-166 p.

Subjects--Topical Terms:
Intermetalilc
Reliability
Surface Mount Technology

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