Numerical Investigation OfInfluence of Material Properties and Adhesive Layer Thickness onHeating Efficiency of Microwave Curing of an Adhesive-Bonded Joint (Record no. 743179)

MARC details
000 -LEADER
fixed length control field 00609nab a2200157Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2004 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name So, H. W.
9 (RLIN) 772174
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Taube, A.
9 (RLIN) 772175
245 #0 - TITLE STATEMENT
Title Numerical Investigation OfInfluence of Material Properties and Adhesive Layer Thickness onHeating Efficiency of Microwave Curing of an Adhesive-Bonded Joint
300 ## - PHYSICAL DESCRIPTION
Extent 1414-1418 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Numerical Investigation
9 (RLIN) 753016
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Material Parameters
9 (RLIN) 754065
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Adhesive Lyer Profile Effect
9 (RLIN) 775537
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2004
Title Polymer Engineering and Science
International Standard Serial Number 00323888
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
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  Engr Abul Kalam Library Vol.44, No.08 (Aug. 2004)   19/08/2023 Articles