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Numerical Investigation OfInfluence of Material Properties and Adhesive Layer Thickness onHeating Efficiency of Microwave Curing of an Adhesive-Bonded Joint

So, H. W. Taube, A.

Numerical Investigation OfInfluence of Material Properties and Adhesive Layer Thickness onHeating Efficiency of Microwave Curing of an Adhesive-Bonded Joint - 1414-1418 p.

Subjects--Topical Terms:
Numerical Investigation
Material Parameters
Adhesive Lyer Profile Effect

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