To Cut Or Not to Cut a Thermomechanical Stress Analysis of Polyimide Thin-Film on Ceramic Structures (Record no. 743162)

MARC details
000 -LEADER
fixed length control field 00640nab a2200169Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s1995 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Pecht, Michael
9 (RLIN) 202261
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Paik, Hye-Young
9 (RLIN) 775512
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Bhandarkar, S. Navin
9 (RLIN) 775514
245 #0 - TITLE STATEMENT
Title To Cut Or Not to Cut a Thermomechanical Stress Analysis of Polyimide Thin-Film on Ceramic Structures
300 ## - PHYSICAL DESCRIPTION
Extent 150-153 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Creep Test
9 (RLIN) 682162
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Thermomecanique
9 (RLIN) 775515
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Multilayer
9 (RLIN) 688395
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 1995
Title IEEE Transactions on Components, Packaging, and Manufacturing Technology Part-B: Advanced Packaging
International Standard Serial Number 10709894
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
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-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.18, No.01 (Feb. 1995)   19/08/2023 Articles