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To Cut Or Not to Cut a Thermomechanical Stress Analysis of Polyimide Thin-Film on Ceramic Structures

Pecht, Michael Paik, Hye-Young Bhandarkar, S. Navin

To Cut Or Not to Cut a Thermomechanical Stress Analysis of Polyimide Thin-Film on Ceramic Structures - 150-153 p.

Subjects--Topical Terms:
Creep Test
Thermomecanique
Multilayer

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