Humidity and Reflow Resistance of Flip Chip on Foil Assemblies with Conductive Adhesive Joints (Record no. 742377)

MARC details
000 -LEADER
fixed length control field 00564nab a2200157Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230808s2003 |||||||f |||| 00| 0 eng d
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Vries, J. Hans De
9 (RLIN) 773697
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Janssen, Esther
9 (RLIN) 773699
245 #0 - TITLE STATEMENT
Title Humidity and Reflow Resistance of Flip Chip on Foil Assemblies with Conductive Adhesive Joints
300 ## - PHYSICAL DESCRIPTION
Extent 563-568 p.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Conductive Adhesive
9 (RLIN) 773700
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Flip Chi P
9 (RLIN) 773702
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Flexible Structure
9 (RLIN) 768679
773 ## - HOST ITEM ENTRY
Place, publisher, and date of publication 2003
Title IEEE Transactions on Components and Packaging Technologies
International Standard Serial Number 15213331
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Articles
-- 51
-- ABUL KALAM Library
Holdings
Not for loan Home library Serial Enumeration / chronology Total Checkouts Date last seen Koha item type
  Engr Abul Kalam Library Vol.26, No.03 (Sep. 2003)   19/08/2023 Articles