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Humidity and Reflow Resistance of Flip Chip on Foil Assemblies with Conductive Adhesive Joints

Vries, J. Hans De Janssen, Esther

Humidity and Reflow Resistance of Flip Chip on Foil Assemblies with Conductive Adhesive Joints - 563-568 p.

Subjects--Topical Terms:
Conductive Adhesive
Flip Chi P
Flexible Structure

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