ImprovimgElectrical Integrity of Cu-Cosi2 Contacted N+P Junction Diodes Using Nitrogen-Incorporated Ta Films As A Diffusion Barrier
Yang, Wei-Bin
ImprovimgElectrical Integrity of Cu-Cosi2 Contacted N+P Junction Diodes Using Nitrogen-Incorporated Ta Films As A Diffusion Barrier - 1947-1954 p.
Cobalt Oxides
Copper Conductor
Diffusion Barriers
ImprovimgElectrical Integrity of Cu-Cosi2 Contacted N+P Junction Diodes Using Nitrogen-Incorporated Ta Films As A Diffusion Barrier - 1947-1954 p.
Cobalt Oxides
Copper Conductor
Diffusion Barriers