Normal view MARC view ISBD view

Electrical Test Strategies for A Wafer-Level Packaging Technology

Keezer, David C. Patel, Chirag S. Bakir, Muhannad S. Zhou, Qing

Electrical Test Strategies for A Wafer-Level Packaging Technology - 267-272 p.

Subjects--Topical Terms:
Interconnections
Packaging
Testing

Print
Request article
Suggest for purchase
Send to device
Save record
BIBTEX Dublin Core ISBD MARCXML RIS
More searches

Search for this title in:
Other Databases (Google Scholar) Open Library (openlibrary.org) Pakistan Union Catalogue (pastic.gov.pk) Other Libraries (WorldCat)