Normal view MARC view ISBD view

A Reliability of Barrier-Metal-Clad Copper Interconnects with Self-Aligned Metallic Caps

Tatsuyuki, Saito Ashihara, Hiroshi

A Reliability of Barrier-Metal-Clad Copper Interconnects with Self-Aligned Metallic Caps - 2129-2135 p.

Subjects--Topical Terms:
Chemical Vapor Deposition (Cvd)
Copper Losses
Electromigration

Print
Request article
Suggest for purchase
Send to device
Save record
BIBTEX Dublin Core ISBD MARCXML RIS
More searches

Search for this title in:
Other Databases (Google Scholar) Open Library (openlibrary.org) Pakistan Union Catalogue (pastic.gov.pk) Other Libraries (WorldCat)