Planarized Multilevel Interconnection Using Chemical Mechanical Polishing of Selective Cvd-Ai Via Plugs
Amazawa, Takao Arita, Yoshinobu Yamamoto, EIIchi
Planarized Multilevel Interconnection Using Chemical Mechanical Polishing of Selective Cvd-Ai Via Plugs - 815-820 p.
Aluminum Integrated Circuit Conductors
Electromigration
Cmp
Planarized Multilevel Interconnection Using Chemical Mechanical Polishing of Selective Cvd-Ai Via Plugs - 815-820 p.
Aluminum Integrated Circuit Conductors
Electromigration
Cmp